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ADRF6750ACPZ-R7 数据表(PDF) 32 Page - Analog Devices |
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ADRF6750ACPZ-R7 数据表(HTML) 32 Page - Analog Devices |
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32 / 40 page ![]() ADRF6750 Rev. A | Page 32 of 40 EVALUATION BOARD GENERAL DESCRIPTION This board is designed to allow the user to evaluate the performance of the ADRF6750. It contains the following: • I/Q modulator with integrated fractional-N PLL and VCO • SPI and I2C interface connectors • DC biasing and filter circuitry for the baseband inputs • Low-pass loop filter circuitry • 10 MHz reference clock • Circuitry to support differential signaling to the TESTLO inputs, including dc biasing circuitry • Circuitry to monitor the LOMON outputs • SMA connectors for power supplies and the RF output The evaluation board comes with associated software to allow easy programming of the ADRF6750. HARDWARE DESCRIPTION For more information, refer to the circuit diagram in Figure 71. Power Supplies An external 5 V supply (DUT +5 V) drives both an on-chip 3.3 V regulator and the quadrature modulator. The regulator feeds the VREG1 through VREG6 pins on the chip with 3.3 V. These pins power the PLL circuitry. The external reference clock generator can be driven by a 3 V supply or by a 5 V supply. These supplies can be connected via an SMA connector, VCO +V. Recommended Decoupling for Supplies The external 5 V supply is decoupled initially by a 10 μF capacitor and then further by a parallel combination of 100 nF and 10 pF capacitors that are placed as close to the DUT as possible for good local decoupling. The regulator output should be decoupled by a parallel combination of 10 pF and 220 μF capacitors. The 220 μF capacitor decouples broadband noise, which leads to better phase noise and is recommended for best performance. Case Size C 220 μF capacitors are used to minimize area. A parallel combi- nation of 100 nF and 10 pF capacitors should be placed on each VREGx pin. Again, these capacitors are placed as close to the pins as possible. The impedance of all these capacitors should be low and constant across a broad frequency range. Surface-mount multilayered ceramic chip (MLCC) Class II capacitors provide very low ESL and ESR, which assist in decoupling supply noise effectively. They also provide good temperature stability and good aging characteristics. Capacitance also changes vs. applied bias voltage. Larger case sizes have less capacitance change vs. applied bias voltage and also lower ESR but higher ESL. The 0603 size capacitors provide a good compromise. X5R and X7R capacitors are examples of these types of capacitors and are recommended for decoupling. SPI and I2C Interface The SPI interface connector is a 9-way, D-type connector that can be connected to the printer port of a PC. Figure 70 shows the PC cable diagram that must be used with the provided software. There is also an option to use the I2C interface by using the I2C receptacle connector. This is a standard I2C connector. Pull-up resistors are required on the signal lines. The CS pin can be used to set the slave address of the ADRF6750. CS high sets the slave address to 0x60, and CS low sets the slave address to 0x40. 6 7 8 9 1 9-WAY FEMALE D-TYPE 25-WAY MALE D-TYPE TO PC PRINTER PORT GND CLK DATA LE 2 3 4 5 21 22 23 24 25 8 9 10 11 12 4 5 6 7 1 2 3 16 17 18 19 20 14 15 13 PC Figure 70. SPI PC Cable Diagram |
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