ADM1275-2ARQZ-R7 datasheet(8/48 Pages) AD

8 / 48 page

ADM1275

Data Sheet

Rev. D | Page 8 of 48

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VCC Pin

−0.3 V to +25 V

UV Pin

−0.3 V to +4 V

OV Pin

−0.3 V to +4 V

SS Pin

−0.3 V to VCAP + 0.3 V

TIMER Pin

−0.3 V to VCAP + 0.3 V

VCAP Pin

−0.3 V to +4 V

ISET Pin

−0.3 V to VCAP + 0.3 V

LATCH Pin

−0.3 V to +25 V

SCL Pin

−0.3 V to +6.5 V

SDA Pin

−0.3 V to +6.5 V

ADR Pin

−0.3 V to VCAP + 0.3 V

GPO1/ALERT1/CONV Pin, ENABLE Pin

−0.3 V to +25 V

GPO2/ALERT2 Pin

−0.3 V to +25 V

PWRGD Pin

−0.3 V to +25 V

FLB Pin

−0.3 V to +25 V

VOUT Pin

−0.3 V to +25 V

GATE Pin (Internal Supply Only)1

−0.3 V to +36 V

SENSE+ Pin

−0.3 V to +25 V

SENSE− Pin

−0.3 V to +25 V

VSENSE (VSENSE+ − VSENSE−)

±0.3 V

Continuous Current into Any Pin

±10 mA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature, Soldering (10 sec)

300°C

Junction Temperature

150°C

The GATE pin has internal clamping circuits to prevent the GATE pin voltage

from exceeding the maximum ratings of a MOSFET with VGSMAX = 20 V and

internal process limits. Applying a voltage source to this pin externally may

cause irreversible damage.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

Unit

16-lead QSOP (RQ-16)

150

°C/W

20-lead QSOP (RQ-20)

126

°C/W

20-lead LFCSP (CP-20-9)

30.4

°C/W

ESD CAUTION

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