STM32F207IE datasheet(70/178 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32F20xxx

70/178

DocID15818 Rev 11

VBAT

Backup operating voltage

1.65

3.6

VIN

I/O input voltage

FT and TTa I/O

TBD

BOOT0

TBD

VCAP1

Internal core voltage to be supplied

externally in REGOFF mode

1.1

1.3

VCAP2

Power dissipation at TA = 85 °C for

suffix 6 or TA = 105 °C for suffix 7(5)

LQFP64

444

WLCSP64+2

392

LQFP100

434

LQFP144

500

LQFP176

526

UFBGA176

513

Ambient temperature for 6 suffix

version

Maximum power dissipation

–40

°C

Low power dissipation(6)

–40

105

Ambient temperature for 7 suffix

version

Maximum power dissipation

–40

105

°C

Low power dissipation(6)

–40

125

Junction temperature range

6 suffix version

–40

105

°C

7 suffix version

–40

125

1. TBD stands for “to be defined”.

2. On devices in WLCSP64+2 package, if IRROFF is set to VDD, the supply voltage can drop to 1.7 V when the device

operates in the 0 to 70 °C temperature range using an external power supply supervisor (see Section 3.16).

3. When the ADC is used, refer to Table 66: ADC characteristics.

4. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and

VDDA can be tolerated during power-up and power-down operation.

5. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.

6. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.

Table 14. General operating conditions(1) (continued)

Symbol

Parameter

Conditions

Min

Max

Unit

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