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EM260-RTR 数据表(PDF) 12 Page - Silicon image |
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EM260-RTR 数据表(HTML) 12 Page - Silicon image |
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12 / 50 page EM260 120-0260-000M Rev 1.1 Page 12 3.5 Digital I/O Specifications Table 6 contains the digital I/O specifications for the EM260. The digital I/O power (named VDD_PADS) comes from three dedicated pins (pins 13, 19, and 24). The voltage applied to these pins sets the I/O voltage. Table 6. Digital I/O Specifications Parameter Name Min. Typ. Max. Unit Voltage supply VDD_PADS 2.1 3.6 V Input voltage for logic 0 VIL 0 0.2 x VDD_PADS V Input voltage for logic 1 VIH 0.8 x VDD_PADS VDD_PADS V Input current for logic 0 IIL -0.5 μA Input current for logic 1 IIH 0.5 μA Input pull-up resistor value RIPU 30 k Input pull-down resistor value RIPD 30 k Output voltage for logic 0 VOL 0 0.18 x VDD_PADS V Output voltage for logic 1 VOH 0.82 x VDD_PADS VDD_PADS V Output source current (standard current pad) IOHS 4 mA Output sink current (standard current pad) IOLS 4 mA Output source current (high current pad: pins 33, 34, and 35) IOHH 8 mA Output sink current (high current pad: pins 33, 34, and 35) IOLH 8 mA Total output current (for I/O pads) IOH + IOL 40 mA Input voltage threshold for OSCA 0.2 x VDD_CORE 0.8 x VDD_PADS V Output voltage level (TX_ACTIVE) 0.18 x VDD_CORE 0.82 x VDD_CORE V Output source current (TX_ACTIVE) 1 mA |
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