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AS3709 数据表(PDF) 65 Page - ams AG |
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AS3709 数据表(HTML) 65 Page - ams AG |
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65 / 74 page ![]() ams Datasheet, Confidential: 2013-Aug [1-02] AS3709 – 65 Ap pl ication I n f o rmation PCB with minimum 4 layers is recommended. Figure 89: Layout Guidelines 2/2 Layout Guidelines 2/2: Layout Guidelines 2/2: This figure shows the recommended layout and placement of the external components for the 1 x 2A & 1 x 3A application circuit. Red lines and areas are connections on TOP layer. Grey lines and areas are GND and PVSS connections on TOP layer. Light blue lines and areas are connections on an inner layer or BOTTOM layer. Black round dots are vias. VSUP areas should be connected to an inner VSUP plane via vias. GND and PVSS areas should be connected to an inner GND plane via vias. A PCB with minimum 4 layers is recommended. 1 3 5 7 AS3709 QFN 32-pin 4x4mm Exposed Pad: GND 24 22 20 18 23 21 19 17 2 4 6 8 33 LX_SD5 LX_SD4 VSUP_SD3 LX_SD3 VSUP_SD2 FB_SD1 PVSS_SD1 LX_SD1 FB_SD3 PVSS_SD4 SD3 & SD4 & SD5 SD1 & SD1 VSUP SD4+SD5 CIN_SD1 COUT_SD1/2 COUT_SD1/2 CIN_SD2 L1 L3 COUT_SD3/4/5 COUT_SD3/4/5 COUT_SD3/4/5 CIN_SD5 CIN_SD4 CIN_SD3 VSUP_SD1 LX_SD1 FB_SD1 |
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