DocID16891 Rev 30

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M24C64-W M24C64-R M24C64-F

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

Figure 17. UFDFPN5 (MLP5) – package outline (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

1. On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from

the orientation of the marking: when reading the marking, pin 1 is below the upper left package corner.

Table 18. UFDFPN5 (MLP5) – package dimensions (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

Symbol

millimeters

1.

Typ

Min

Max

Typ

Min

Max

A

0.550

0.500

0.600

0.0217

0.0197

0.0236

A1

–

0

0.050

–

0

0.0020

b

0.220

0.180

0.260

0.0087

0.0071

0.0102

D

1.700

1.600

1.800

0.0669

0.0630

0.0709

D1

1.500

1.400

1.600

0.0591

0.0551

0.0630

E

1.400

1.300

1.500

0.0551

0.0512

0.0591

E1

0.220

0.180

0.260

0.0087

0.0071

0.0102

e

0.400

–

–

0.0157

–

–

L

0.550

0.500

0.600

0.0217

0.0197

0.0236

k

0.400

–

–

0.0157

–

–