M24C64-R datasheet(39/45 Pages) STMICROELECTRONICS

部件名	M24C64-R

功能描述	64-Kbit serial I짼C bus EEPROM

PDF	45 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

39 / 45 page

DocID16891 Rev 30

39/45

M24C64-W M24C64-R M24C64-F

Figure 23. Thin WLCSP 8-bump wafer-length chip-scale package outline

(M24C64-DFCT6TP/K)

1. Drawing is not to scale.

2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).

Table 24. Thin WLCSP 8-bump wafer-length chip-scale package mechanical data

(M24C64-DFCT6TP/K)

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

0.315

0.300

0.330

0.0124

0.0118

0.0130

0.115

0.0045

0.200

0.0079

b(2)

2. Dimension measured at the maximum bump diameter parallel to primary datum Z.

0.160

0.0063

1.073

1.093

0.0422

0.0430

0.959

0.979

0.0378

0.0385

0.693

0.0273

0.800

0.0315

0.400

0.0157

0.133

0.0052

0.137

0.00524

aaa

0.110

0.0043

eee

0.060

0.0043

M24C64-R 数据表(PDF) 39 Page - STMicroelectronics

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