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M24C64-R 数据表(PDF) 38 Page - STMicroelectronics |
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M24C64-R 数据表(HTML) 38 Page - STMicroelectronics |
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38 / 45 page ![]() Package mechanical data M24C64-W M24C64-R M24C64-F 38/45 DocID16891 Rev 30 Figure 22. WLCSP 5-bump wafer-length chip-scale package outline (M24C64-FCS6TP/K) 1. Drawing is not to scale. 2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow). Table 23. WLCSP 5-bump wafer-length chip-scale package mechanical data (M24C64-FCS6TP/K) Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to four decimal digits. Typ Min Max Typ Min Max A 0.545 0.490 0.600 0.0215 0.0193 0.0236 A1 0.190 0.0075 A2 0.355 0.0140 b(2) 2. Dimension measured at the maximum bump diameter parallel to primary datum Z. 0.270 0.0106 D 0.959 1.074 0.0378 0.0423 E 1.073 1.168 0.0422 0.0460 e 0.693 0.0273 e1 0.400 0.0157 e2 0.3465 0.0136 F 0.280 0.0110 G 0.190 0.0075 aaa 0.110 0.0043 eee 0.060 0.0024 |
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