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LT1336CS 数据表(PDF) 12 Page - Linear Technology |
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LT1336CS 数据表(HTML) 12 Page - Linear Technology |
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12 / 16 page ![]() 12 LT1336 APPLICATIONS INFORMATION Paralleling MOSFETs When the above calculations result in a lower RDS(ON) than is economically feasible with a single MOSFET, two or more MOSFETs can be paralleled. The MOSFETs will inherently share the currents according to their RDS(ON) ratio as long as they are thermally connected (e.g., on a common heat sink). The LT1336 top and bottom drivers can each drive five power MOSFETs in parallel with only a small loss in switching speeds (see Typical Performance Characteristics). A low value resistor (10 Ω to 47Ω) in series with each individual MOSFET gate may be required to “decouple” each MOSFET from its neighbors to prevent high frequency oscillations (consult manufacturer’s rec- ommendations). If gate decoupling resistors are used, the corresponding Gate Feedback pin can be connected to any one of the gates as shown in Figure 3. Driving multiple MOSFETs in parallel may restrict the operating frequency to prevent overdissipation in the LT1336 (see the following Gate Charge and Driver Dissipation). The actual increase in supply current is slightly higher due to LT1336 switching losses and the fact that the gates are being charged to more than 10V. Supply Current vs Switching Frequency is given in the Typical Performance Characteristics. The LT1336 junction temperature can be estimated by using the equations given in Note 1 of the Electrical Characteristics. For example, the LT1336IS is limited to less than 31mA from a 12V supply: TJ = 85°C + (31mA)(12V)(110°C/W) = 126 °C exceeds absolute maximum In order to prevent the maximum junction temperature from being exceeded, the LT1336 supply current must be verified while driving the full complement of the chosen MOSFET type at the maximum switching frequency. Ugly Transient Issues In PWM applications the drain current of the top MOSFET is a square wave at the input frequency and duty cycle. To prevent large voltage transients at the top drain, a low ESR electrolytic capacitor must be used and returned to the power ground. The capacitor is generally in the range of 25 µF to 5000µF and must be physically sized for the RMS current flowing in the drain to prevent heating and prema- ture failure. In addition, the LT1336 requires a separate 10 µF capacitor connected closely between Pins 2 and 6. The LT1336 top source is internally protected against transients below ground and above supply. However, the Gate Drive pins cannot be forced below ground. In most applications, negative transients coupled from the source to the gate of the top MOSFET do not cause any problems. Switching Regulator Applications The LT1336 is ideal as a synchronous switch driver to improve the efficiency of step-down (buck) switching regulators. Most step-down regulators use a high current Schottky diode to conduct the inductor current when the switch is off. The fractions of the oscillator period that the switch is on (switch conducting) and off (diode conduct- ing) are given by: Figure 3. Paralleling MOSFETs GATEDR GATEFB LT1336 RG* RG* HV *OPTIONAL 10 Ω 1336 F03 + Gate Charge and Driver Dissipation A useful indicator of the load presented to the driver by a power MOSFET is the total gate charge QG, which includes the additional charge required by the gate-to-drain swing. QGisusuallyspecifiedforVGS=10VandVDS=0.8VDS(MAX). When the supply current is measured in a switching application, it will be larger than given by the DC electrical characteristics because of the additional supply current associated with sourcing the MOSFET gate charge: II dQ dt dQ dt SUPPLY DC G TOP G BOTTOM =+ + |
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