UPD75316BGC datasheet(71/77 Pages) NEC

71 / 77 page

µPD75312B, 75316B

14. RECOMMENDED SOLDERING CONDITIONS

The product should be soldered and mounted under the conditions recommended in the table below.

For the details of recommended soldering conditions, refer to the information document “Semiconductor Device

Mounting Technology Manual” (IEI-1207).

For soldering methods and conditions other than those recommended below, contact an NEC sales represen-

tative.

Table 14-1 Surface Mounting Type Soldering Conditions

µPD75312BGC-×××-3B9 : 80-pin plastic QFP (14 x 14 mm)

µPD75316BGC-×××-3B9 : 80-pin plastic QFP (14 x 14 mm)

Recommended

Condition Symbol

Package peak temperature: 235

°C, Time: Within 30 s (at 210 °C or higher), Count:

Twice or less

(1)

Perform the second reflow when the device temperature has come down to

the room temperature from the heating by the first reflow.

(2)

Do not wash flux away with water after the first reflow.

Package peak temperature: 215

°C, Time: Within 40 s (at 200 °C or higher), Count:

Twice or less

(1)

Perform the second reflow when the device temperature has come down to

the room temperature from the heating by the first reflow.

(2)

Do not wash flux away with water after the first reflow.

Soldering tank temperature: 260

°C or less, Time: Within 10 s, Count: Once,

Preheating temperature: 120

°C MAX. (package surface temperature)

Pin temperature: 300

°C or less, Time: Within 3 s (per side of device)

IR35-00-2

VP15-00-2

WS60-00-1

Partial heating

Infrared reflow

VPS

Wave soldering

Caution:

Do not use several soldering methods in combination (except partial heating).

Soldering Method

Soldering Conditions

UPD75316BGC 数据表(PDF) 71 Page - NEC

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