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ICS831752I 数据表(PDF) 4 Page - Integrated Device Technology

部件名 ICS831752I
功能描述  LVCMOS interface levels for the control inputs
PDF  16 Pages
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制造商  IDT [Integrated Device Technology]
网页  http://www.idt.com
标志 IDT - Integrated Device Technology

ICS831752I 数据表(HTML) 4 Page - Integrated Device Technology

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ICS831752I Data Sheet
CLOCK SWITCH FOR ATCA/AMC AND PCIe APPLICATIONS
ICS831752AGI REVISION A JUNE 28, 2012
4
©2012 Integrated Device Technology, Inc.
Table 4C. Differential DC Characteristics, VDD = 3.3V±5% or 2.5V±5%, TA = -40°C to 85°C
NOTE 1: VIL should not be less than -0.3V.
NOTE 2: Common mode input voltage is defined as VIH.
AC Electrical Characteristics
Table 5A. PCI Express Jitter Specifications, VDD = 3.3V±5% or 2.5V±5%, TA = -40°C to 85°C
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium
has been reached under these conditions. For additional information, refer to the PCI Express Application Note section in the datasheet.
NOTE: PCI Express JItter Specifications apply to FCLK and nFCLK and Q,nQ operating as outputs. The source generator used in the PCI
Express Jitter measurements is the Stanford Research Systems CG635 2.0GHz Synthezized Clock Generator.
NOTE 1: Peak-to-Peak jitter after applying system transfer function for the Common Clock Architecture. Maximum limit for PCI Express
Gen 1 is 86ps peak-to-peak for a sample size of 106 clock periods.
NOTE 2: RMS jitter after applying the two evaluation bands to the two transfer functions defined in the Common Clock Architecture and
reporting the worst case results for each evaluation band. Maximum limit for PCI Express Gen 2 is 3.1ps RMS for tREFCLK_HF_RMS (High
Band) and 3.0ps RMS for tREFCLK_LF_RMS (Low Band).
NOTE 3: RMS jitter after applying system transfer function for the common clock architecture. This specification is based on the PCI Express
Base Specification Revision 0.7, October 2009 and is subject to change pending the final release version of the specification.
NOTE 4: This parameter is guaranteed by characterization. Not tested in production.
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
IIH
Input
High Current
CLK, nCLK
VDD = VIN = 3.3V
150
µA
IIL
Input
Low Current
CLK
VDD = 3.3V, VIN = 0V
-5
µA
nCLK
VDD = 3.3V, VIN = 0V
-150
µA
VPP
Peak-to-Peak Voltage; NOTE 1
0.15
1.3
V
VCMR
Common Mode Input Voltage;
NOTE 1, 2
0.5
VDD – 0.85
V
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
PCIe Industry
Specification
Units
tj
(PCIe Gen 1)
Phase Jitter
Peak-to-Peak;
NOTE 1, 4
ƒ= 100MHz
Evaluation Band: 0Hz - Nyquist
(clock frequency/2)
9.95
15.5
86
ps
tREFCLK_HF_RMS
(PCIe Gen 2)
Phase Jitter RMS;
NOTE 2, 4
ƒ= 100MHz
High Band: 1.5MHz - Nyquist
(clock frequency/2)
0.82
1.12
3.1
ps
tREFCLK_LF_RMS
(PCIe Gen 2)
Phase Jitter RMS;
NOTE 2, 4
ƒ= 100MHz
Low Band: 10kHz - 1.5MHz
0.04
0.08
3.0
ps
tREFCLK_RMS
(PCIe Gen 3)
Phase Jitter RMS;
NOTE 3, 4
ƒ= 100MHz
Evaluation Band: 0Hz - Nyquist
(clock frequency/2)
0.153
0.203
0.8
ps



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