L7292 datasheet(56/60 Pages) STMICROELECTRONICS

部件名	L7292

功能描述	Five buck regulators power management unit

PDF	60 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

56 / 60 page

PCB design rules guideline

L7292

56/60

DocID028601 Rev 1

13.4

General rules



Do not share vias. Every component connecting to the power or the reference plane

needs its own via.



For large currents multiple vias are to be preferred.



Vias shall be placed as close as possible to the component pin.



Feedback nodes are sensitive. Keep them away from magnetic fields and nodes that

may capacitive couple energy into them.

13.5

Thermal aspects

The device package uses the center pad as a thermal conduit. This pad should be

connected to an adequate spread of copper. When following the suggested layer stack the

internal ground plane may be sufficient. If lots of other heat generating components are

close by it may be necessary to create an exposed copper area on the backside of the

board. The pad should be connected using multiple vias.

L7292 数据表(PDF) 56 Page - STMicroelectronics