LSM6DS3H datasheet(15/104 Pages) STMICROELECTRONICS

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LSM6DS3H

Overview

104

Overview

The LSM6DS3H is a system-in-package featuring a high-performance 3-axis digital

accelerometer and 3-axis digital gyroscope.

The integrated power-efficient modes are able to reduce the power consumption down to

1.1 mA in high-performance mode, combining always-on low-power features with superior

sensing precision for an optimal motion experience for the consumer thanks to ultra-low

noise performance for both the gyroscope and accelerometer.

The LSM6DS3H delivers best-in-class motion sensing that can detect orientation and

gestures in order to empower application developers and consumers with features and

capabilities that are more sophisticated than simply orienting their devices to portrait and

landscape mode.

The event-detection interrupts enable efficient and reliable motion tracking and contextual

awareness, implementing hardware recognition of free-fall events, 6D orientation, tap and

double-tap sensing, activity or inactivity, and wakeup events.

The LSM6DS3H supports main OS requirements, offering real, virtual and batch mode

sensors. In addition, the LSM6DS3H can efficiently run the sensor-related features specified

in Android, saving power and enabling faster reaction time. In particular, the LSM6DS3H

has been designed to implement hardware features such as significant motion, tilt,

pedometer functions, timestamping and to support the data acquisition of an external

magnetometer with ironing correction (hard, soft).

The LSM6DS3H offers hardware flexibility to connect the pins with different mode

connections to external sensors to expand functionalities such as adding a sensor hub,

auxiliary SPI, etc. The application processor connection is supported by both SPI and I2C

interfaces for complete interface flexibility.

Up to 8 kbyte of FIFO [4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable)] with

dynamic allocation of significant data (i.e. external sensors, timestamp, etc.) allows overall

power saving of the system.

Like the entire portfolio of MEMS sensor modules, the LSM6DS3H leverages the robust and

mature in-house manufacturing processes already used for the production of

micromachined accelerometers and gyroscopes. The various sensing elements are

manufactured using specialized micromachining processes, while the IC interfaces are

developed using CMOS technology that allows the design of a dedicated circuit which is

trimmed to better match the characteristics of the sensing element.

The LSM6DS3H is available in a small plastic land grid array (LGA) package of

2.5 x 3.0 x 0.83 mm to address ultra-compact solutions.

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