VL6180X datasheet(11/79 Pages) STMICROELECTRONICS

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DocID026171 Rev 6

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VL6180X

Overview

1.5

Recommended solder pad dimensions

Figure 4. Recommended solder pattern

1.6

Recommended reflow profile

The recommend reflow profile is shown in Figure 5 and Table 3.

Figure 5. Recommended reflow profile

Note:

As the VL6180X package is not sealed, only a dry re-flow process should be used (such as

convection re-flow). Vapor phase re-flow is not suitable for this type of optical component.

The VL6180X is an optical component and as such, it should be treated carefully. This

would typically include using a ‘no-wash’ assembly process.

0.55 mm

0.60 mm

Pad pitch 0.75 mm

1.40 mm

Same as device pad dimensions

Table 3. Recommended reflow profile

Profile

Ramp to strike

Temperature gradient in preheat

(T= 70 - 180

°C):

0.9 +/- 0.1

°C/s

Temperature gradient

(T= 200 - 225

°C):

1.1 - 3.0

°C/s

Peak temperature in reflow

237

°C - 245°C

Time above 220

°C

50 +/- 10 seconds

Temperature gradient in cooling

-1 to -4

°C/s (-6°C/s maximum)

Time from 50 to 220

°C

160 to 220 seconds

VL6180X 数据表(PDF) 11 Page - STMicroelectronics

VL6180X 数据表(HTML) 11 Page - STMicroelectronics

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