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LP38853 数据表(PDF) 3 Page - Texas Instruments |
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LP38853 数据表(HTML) 3 Page - Texas Instruments |
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3 / 30 page ![]() DAP Connect to GND IN EN N/C SS 5 6 7 8 OUT ADJ GND BIAS 1 2 3 4 TAB IS GND BIAS OUT GND SS 1 2 3 4 5 IN 6 7 ADJ EN TAB IS GND BIAS OUT GND SS 1 2 3 4 5 IN 6 7 ADJ EN LP38853 www.ti.com SNVS335E – DECEMBER 2006 – REVISED NOVEMBER 2015 5 Pin Configuration and Functions KTW Package NDZ Package 7-Pin DDPAK/TO-263 7-Pin TO-220 Top Top View DDA Package 8-Pin SO PowerPAD Top View Pin Functions PIN TYPE DESCRIPTION NAME DDPAK/TO-263 TO-220 SO PowerPAD-8 ADJ 5 5 1 O The feedback connection to set the output voltage BIAS 7 7 3 I The supply for the internal control and reference circuitry. EN 2 2 6 I Device enable, High = On, Low = Off. The SO PowerPAD DAP is a thermal connection only that is DAP — — DAP — physically attached to the backside of the die, and used as a thermal heat-sink connection. GND 4 4 4 GND Ground IN 3 3 7 I The unregulated voltage input N/C — — 8 — No internal connection OUT 6 6 2 O The regulated output voltage Soft-start capacitor connection. Used to control the rise time of VOUT SS 1 1 5 O at turnon. The KTW and NDZ TAB is a thermal and electrical connection that TAB TAB TAB — — is physically attached to the backside of the die, and used as a thermal heat-sink connection. Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LP38853 |
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