P89LPC921 datasheet(43/45 Pages) PHILIPS

43 / 45 page

Philips Semiconductors

P89LPC920/921/922

8-bit microcontrollers with two-clock 80C51 core

Product data

Rev. 06 — 21 November 2003

43 of 45

9397 750 12285

[3]

These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must

on no account be processed through more than one soldering cycle or subjected to infrared reﬂow

soldering with peak temperature exceeding 217

°C ± 10 °C measured in the atmosphere of the reﬂow

oven. The package body peak temperature must be kept as low as possible.

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex

foil by using a hot bar soldering process. The appropriate soldering proﬁle can be provided on

request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Revision history

Table 13:

Revision history

Rev Date

CPCN

Description

20031121

Product data (9397 750 12285); ECN 853-2403 01-A14557 of 18 November 2003

Modiﬁcation:

• Table 8 “DC electrical characteristics” on page 35:ITL VIN conditions, changed value from

1.5 V to 2.0 V

20031007

Product data (9397 750 12121); ECN 853-2403 30391 of 30 September 2003

20030909

Product data (9397 750 11945); ECN 853-2403 30305 of 5 September 2003

20030811

Preliminary data (9397 750 11786)

20030522

Objective data (9397 750 11532)

20030505

Preliminary data (9397 750 11387)

P89LPC921 数据表(PDF) 43 Page - NXP Semiconductors

P89LPC921 数据表(HTML) 43 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45

数据表下载