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LP8553 数据表(PDF) 1 Page - Texas Instruments |
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LP8553 数据表(HTML) 1 Page - Texas Instruments |
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1 / 42 page  MCU LP8553 SW FB VLDO GNDs EN ISET VDDIO PWM SCLK SDA OUT1 OUT2 OUT3 OUT4 L1 D1 10V ± 40V 5.5V ± 22V FILTER 5V FSET 15 éH VSYNC 210 mA ± 400 mA COUT CIN 10 éF 4.7 éF CVLDO 1 éF VDDIO reference voltage VSYNC signal 120 k # 100 nF 1 éF FAULT Can be left floating if not used 39 pF VIN RISET RFSET VBATT LP8553 www.ti.com SNVS701B – SEPTEMBER 2011 – REVISED JANUARY 2014 LP8553 High-Efficiency LED Backlight Driver for Notebooks Check for Samples: LP8553 1 FEATURES APPLICATIONS 2 • High-Voltage DC/DC Boost Converter with • Notebook and Netbook LCD Display LED Integrated FET with Four Switching Frequency Backlight Options: 156/312/625/1250 kHz • LED Lighting • 2.7V to 22V Input Voltage Range to Support 1x…5x Cell Li-Ion Batteries DESCRIPTION The LP8553 is a white LED driver with integrated • Programmable PWM Resolution boost converter. It has four adjustable current sinks – 8 to 13 True Bit (Steady State) which can be controlled by PWM input or with I2C- – Additional 1 to 3 Bits Using Dithering compatible serial interface. During Brightness Changes The boost converter has adaptive output-voltage • I2C and PWM Brightness Control control based on the LED driver voltages. This • Automatic PWM & Current Dimming for feature minimizes the power consumption by Improved Efficiency adjusting the voltage to lowest sufficient level in all conditions. • PWM Output Frequency and LED Current Set Through Resistors LED outputs have 8-bit current resolution and up to 13-bit PWM resolution with additional 1-3 bit dithering • Optional Synchronization to Display VSYNC to achieve smooth and precise brightness control. Signal Proprietary Phase Shift PWM control is used for LED • 4 LED Outputs with LED Fault (Short/Open) outputs to reduce peak current from the boost Detection converter, thus making the boost capacitors smaller. • Low Input Voltage, Over-Temperature, Over- The Phase Shifting scheme also eliminates audible noise. Current Detection and Shutdown • Minimum Number of External Components • DSBGA 25-Bump Package, 2.466 x 2.466 x 0.6 mm Typical Application (1) 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2011–2014, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
类似零件编号 - LP8553 |
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类似说明 - LP8553 |
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