PCM1802

SLES023B – DECEMBER 2001 – REVISED MARCH 2002

3

www.ti.com

Terminal Functions

TERMINAL

I/O

DESCRIPTIONS

NAME

PIN

I/O

DESCRIPTIONS

AGND

6

–

Analog GND

BCK

11

I/O

Bit clock input/output‡

BYPAS

8

I

HPF bypass control. Low: normal mode (dc cut); High: bypass mode (through)†

DGND

13

–

Digital GND

DOUT

12

O

Audio data output

FMT0

17

I

Audio data format select 0. See data format†

FMT1

18

I

Audio data format select 1. See data format†

FSYNC

9

I/O

Frame synchronous clock input/output‡

LRCK

10

I/O

Sampling clock input/output‡

MODE0

19

I

Mode select 0. See interface mode†

MODE1

20

I

Mode select 1. See interface mode†

OSR

16

I

Oversampling ratio select. Low:

×64 fS; High: ×128 fS†

PDWN

7

I

Power-down control, active low†

SCKI

15

I

System clock input; 256 fS, 384 fS, 512 fS or 768 fS§

VCC

5

–

Analog power supply, 5 V

VDD

14

–

Digital power supply, 3.3 V

VINL

1

I

Analog input, L-channel

VINR

2

I

Analog input, R-channel

VREF1

3

–

Reference 1 decoupling capacitor

VREF2

4

–

Reference 2 voltage input, normally connected to VCC

† Schmitt-trigger input with internal pulldown (50 k

Ω typically), 5-V tolerant

‡ Schmitt-trigger input

§ Schmitt-trigger input, 5-V tolerant

Supply voltage:

6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.0 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ground voltage differences: AGND, DGND

±0.1 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Digital input voltage: FSYNC, LRCK, BCK, DOUT

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PDWN, BYPAS, SCKI, OSR, FMT0, FMT1, MODE0, MODE1

–0.3 V to 6.5 V

. . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input current (any pins except supplies)

±10 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ambient temperature under bias

–40

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature

–55

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Junction temperature

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature (soldering)

260

°C, 5 s

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package temperature (IR reflow, peak)

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

¶ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.