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ADT7461ARMZ-R7 数据表(PDF) 17 Page - ON Semiconductor |
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ADT7461ARMZ-R7 数据表(HTML) 17 Page - ON Semiconductor |
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17 / 20 page ![]() ADT7461 http://onsemi.com 17 Transistors, such as the 2N3904, 2N3906, or equivalents in SOT-23 packages are suitable devices to use. Thermal Inertia and Self-Heating Accuracy depends on the temperature of the remote sensing diode and/or the internal temperature sensor being at the same temperature as the environment being measured; many factors can affect this. Ideally, the sensor should be in good thermal contact with the part of the system being measured. If it is not, the thermal inertia caused by the sensor’s mass causes a lag in the response of the sensor to a temperature change. With a remote sensor, this should not be a problem since it will be either a substrate transistor in the processor or a small package device, such as the SOT-23, placed in close proximity to it. The on-chip sensor, however, is often remote from the processor and only monitors the general ambient temperature around the package. The thermal time constant of the SOIC-8 package in still air is about 140 seconds, and if the ambient air temperature quickly changed by 100 degrees, it would take about 12 minutes (5 time constants) for the junction temperature of the ADT7461 to settle within 1 degree of this. In practice, the ADT7461 package is in electrical, and hence thermal, contact with a PCB and may also be in a forced airflow. How accurately the temperature of the board and/or the forced airflow reflects the temperature to be measured also affects the accuracy. Self-heating due to the power dissipated in the ADT7461 or the remote sensor causes the chip temperature of the device or remote sensor to rise above ambient. However, the current forced through the remote sensor is so small that self-heating is negligible. With the ADT7461, the worst-case condition occurs when the device is converting at 64 conversions per second while sinking the maximum current of 1 mA at the ALERT and THERM output. In this case, the total power dissipation in the device is about 4.5 mW. The thermal resistance, qJA, of the SOIC-8 package is about 121°C/W. Layout Considerations Digital boards can be electrically noisy environments, and the ADT7461 is measuring very small voltages from the remote sensor, so care must be taken to minimize noise induced at the sensor inputs. The following precautions should be taken: 1. Place the ADT7461 as close as possible to the remote sensing diode. Provided the worst noise sources, such as clock generators, data/address buses, and CRTs, are avoided, this distance can be 4 inches to 8 inches. 2. Route the D+ and D– tracks close together, in parallel, with grounded guard tracks on each side. To minimize inductance and reduce noise pick-up, a 5 mil track width and spacing is recommended. Provide a ground plane under the tracks if possible. Figure 23. Typical Arrangement of Signal Tracks 5 MIL 5 MIL 5 MIL 5 MIL 5 MIL 5 MIL 5 MIL GND D− D+ GND 3. Try to minimize the number of copper/solder joints that can cause thermocouple effects. Where copper/solder joints are used, make sure that they are in both the D+ and D− path and at the same temperature. Thermocouple effects should not be a major problem as 1 °C corresponds to about 200 mV, and thermocouple voltages are about 3 mV/ °C of temperature difference. Unless there are two thermocouples with a big temperature differential between them, thermocouple voltages should be much less than 200 mV. 4. Place a 0.1 mF bypass capacitor close to the VDD pin. In extremely noisy environments, an input filter capacitor may be placed across D+ and D− close to the ADT7461. This capacitance can effect the temperature measurement, so care must be taken to ensure any capacitance seen at D+ and D− is a maximum of 1,000 pF. This maximum value includes the filter capacitance plus any cable or stray capacitance between the pins and the sensor diode. 5. If the distance to the remote sensor is more than 8 inches, the use of twisted pair cable is recommended. This works up to about 6 to 12 feet. For extremely long distances (up to 100 feet), use a shielded twisted pair, such as the Belden No. 8451 microphone cable. Connect the twisted pair to D+ and D− and the shield to GND close to the ADT7461. Leave the remote end of the shield unconnected to avoid ground loops. Because the measurement technique uses switched current sources, excessive cable or filter capacitance can affect the measurement. When using long cables, the filter capacitance may be reduced or removed. Application Circuit Figure 24 shows a typical application circuit for the ADT7461 using a discrete sensor transistor connected via a shielded, twisted pair cable. The pull-ups on SCLK, SDATA, and ALERT are required only if they are not already provided elsewhere in the system. The SCLK and SDATA pins of the ADT7461 can be interfaced directly to the SMBus of an I/O controller, such as the Intel® 820 chipset. |
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