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AB18X5-RTC 数据表(PDF) 32 Page - Abracon Corporation |
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AB18X5-RTC 数据表(HTML) 32 Page - Abracon Corporation |
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32 / 37 page ![]() AB18X5 Real-Time Clock with Power Management Family Date of Issue: October 16, 2014 3.0 x 3.0 mm Page 32 of 37 Abracon Drawing #453568 Revision: C 7. Reflow Profile Figure 22 illustrates the reflow soldering requirements. Figure 22. Reflow Soldering Diagram Table 16: Reflow Soldering Requirements (Pb-free assembly) Profile Feature Requirement Preheat/Soak Temperature Min (Tsmin) Temperature Max (Tsmax) Time (ts) from (Tsmin to Tsmax) 150 °C 200 °C 60-120 seconds Ramp-up rate (TL to Tp) 3 °C/second max. Liquidous temperature (TL) Time (tL) maintained above TL 217 °C 60-150 seconds Peak package body temperature (Tp) 260 °C max. Time (tp) within 5 °C of Tp 30 seconds max. Ramp-down rate (Tp to TL) 6 °C/second max. Time 25 °C to peak temperature 8 minutes max. |
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