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6ED003L02-F2 数据表(PDF) 19 Page - Infineon Technologies AG |
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6ED003L02-F2 数据表(HTML) 19 Page - Infineon Technologies AG |
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19 / 20 page ![]() EiceDRIVER™ 6ED003L06-F2, 6ED003L02-F2 datasheet 19 <Revision 2.8>, 05.08.2016 6.2 PG-TSSOP-28 Footprint for Reflow soldering e = 0.65 A = 6.10 L = 1.30 B = 0.40 Figure 17 Package drawing Figure 18 PCB reference layout (according to JEDEC 1s0P) left: Reference layout right: detail of footprint Table 8 Data of reference layout Dimensions Material Metal (Copper) 76.2 114.3 1.5 mm³ FR4 ( therm = 0.3 W/mK) 70µm ( therm = 388 W/mK) |
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