数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

ADL5205ACPZ-R7 数据表(PDF) 7 Page - Analog Devices

部件名 ADL5205ACPZ-R7
功能描述  Dual, 35 dB Range, 1 dB Step Size DGA
PDF  32 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADL5205ACPZ-R7 数据表(HTML) 7 Page - Analog Devices

Back Button ADL5205ACPZ-R7 Datasheet HTML 3Page - Analog Devices ADL5205ACPZ-R7 Datasheet HTML 4Page - Analog Devices ADL5205ACPZ-R7 Datasheet HTML 5Page - Analog Devices ADL5205ACPZ-R7 Datasheet HTML 6Page - Analog Devices ADL5205ACPZ-R7 Datasheet HTML 7Page - Analog Devices ADL5205ACPZ-R7 Datasheet HTML 8Page - Analog Devices ADL5205ACPZ-R7 Datasheet HTML 9Page - Analog Devices ADL5205ACPZ-R7 Datasheet HTML 10Page - Analog Devices ADL5205ACPZ-R7 Datasheet HTML 11Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 7 / 32 page
background image
ADL5205
Data Sheet
Rev. 0 | Page 6 of 31
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Differential Output Voltage Swing ×
Bandwidth Product
3 V-GHz
Supply Voltage, VPOS
5.4 V
PWUPA, PWUPB, A0 to A5, B0 to B5, MODE0,
MODE1, PM, LATCH A, LATCH B
−0.5 V to +3.6 V
Input Voltage (VINx+ ,VINx−)
−0.5 V to +3.1 V
Differential Input Voltage ((VINx+) − (VINx−))
±1 V
Internal Power Dissipation
1000 mW
Maximum Junction Temperature
135°C
Operating Temperature Range
−40°C to +85°C
Storage Temperature Range
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Table 4 shows the thermal resistance from the die to ambient
JA), die to board (θJB), and die to lead (θJC), respectively.
Table 4. Thermal Resistance
Package Type
θJA
θJB
θJC
Unit
40-Lead LFCSP
47.7
24.4
15.4
°C/W
JUNCTION TO BOARD THERMAL IMPEDANCE
The junction to board thermal impedance (θJB) is the thermal
impedance from the die to the leads of the ADL5205. The value
given in Table 4 is based on the standard printed circuit board
(PCB) described in the JESD51-7 standard for thermal testing
of surface-mount components. PCB size and complexity (number
of layers) affect θJB; more layers tend to reduce thermal impedance
slightly.
If the PCB temperature is known, use the junction to board
thermal impedance to calculate the die temperature (also
known as the junction temperature) to ensure that the die
temperature does not exceed the specified limit of 135°C. For
example, if the PCB temperature is 85°C, the die temperature is
given by
TJ = TB + (PDISS × θJB)
The worst case power dissipation for the ADL5205 is 919 mW
(5.25 V × 175 mA, see Table 1). Therefore, TJ is
TJ = 85°C + (0.919 W × 24.4°C/W) = 107.4°C
ESD CAUTION



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com