ZSC31150 Datasheet

© 2016 Integrated Device Technology, Inc.

21

December 6, 2016

5. Package

5.1 SSOP14 Package

The standard packages of the ZSC31150 are the SSOP14 green package (5.3mm body width) with a lead pitch of 0.65mm and the DFN14

(4mmx5mm) package with a lead pitch of 0.5mm.

For the SSOP14 package markings shown in Figure 5.1, YYWW refers to the last two digits of the year (YY) and two digits for the work-week

designation (WW). XXXXXXXX refers to the lot number.

Figure 5.1 SSOP14 Pin Diagram

VDDE

VDD

N.C.

SCL

SDA

VSSA

VDDA

VSSE

AOUT

VBN

VBR_B

VBP

VBR_T

IRTEMP

5.2 14-DFNPackage

For the 14-DFN package, the pin assignment is the same as in SSOP14. Refer to the ZSC31150 Technical Note – Die and Package

Specifications for a description of package markings.

Figure 5.2 provides the dimensions for the 14-DFN package option, which are based on JEDEC MO-229. The 14-DFN package has wettable

flanks.