TMP93CS41DF datasheet(6/48 Pages) TOSHIBA

6 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-6

2002-02-20

Table 2.1

Recommended soldering methods and precautions when mounting

Soldering method

Mounting method

Mounting precaution

Localized heating

method

Soldering iron method

The recommended soldering conditions are as follows:

(1) Standard:

EIAJ ED-4701A-133

Environment test, soldering heat-

resistance test (SMD)

(2) Soldering method: Soldering (lead only)

(3) Soldering condition: (a) at 350

°C for up to 3 seconds.

(b) at 260

°C for up to 10

seconds.

Wave soldering method

(Solder flow)

(1)

Apply preheating for 60 to 120 seconds at a

temperature of 150°C.

(2)

For

lead

insertion-type

packages,

complete

solder

flow

within

seconds

with

the

temperature at the stopper (or, if there is no

stopper, at a location more than 1.5 mm from the

body) which does not exceed 260°C.

(3)

For

surface-mount

packages,

complete

soldering within 5 seconds at a temperature of

250°C or less in order to prevent thermal stress

in the device.

For details, contact your local Toshiba dealer.

Short infrared reflow

method

Because thermal stress is severe, as with solder dipping,

the infrared reflow method is not recommended for some

products. For details, contact your local Toshiba dealer.

Overall heating method

Far or middle infrared

Hot air reflow

The recommended conditions for SMD reflow are as

follows:

(1) Standard:

EIAJ ED-4701 A-133

Environment test

(2) Soldering method: (a) Hot air reflow

(with optional far or middle

infrared reflow process)

(b) Far or middle infrared reflow

(3) Pre-heating: 140 to 160

°C, for 60 to 120 seconds.

(4) Reflow: (a) 240

°C max

(b) At more than 210

°C, for 30 to 50 seconds.

(5) Number of reflows: Maximum of two times within the

allowable period of use

The specified soldering temperatures are based on

the temperature of the package surface.

For a sample recommended temperature profile,

refer to Figure 2.1.

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