TMP93CS41DF datasheet(32/48 Pages) TOSHIBA

32 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-32

2002-02-20

4.2

Storage

4.2.1

General Storage

(1)

Avoid storage locations where devices will be exposed to moisture or

direct sunlight.

(2)

Follow the instructions printed on the

device cartons regarding transportation and

storage.

(3)

The storage area temperature should be

kept within a temperature range of 5°C to

35°C, and relative humidity should be

maintained at between 45% and 75%.

(4)

Do not store devices in the presence of

harmful (especially corrosive) gases, or in

dusty conditions.

(5)

Use storage areas where there is minimal temperature fluctuation. Rapid

temperature changes can cause moisture to form on stored devices,

resulting in lead oxidation or corrosion. As a result, the solderability of

the leads will be degraded.

(6)

When repacking devices, use anti-static containers.

(7)

Do not allow external forces or loads to be applied to devices while they

are in storage.

(8)

If devices have been stored for more than two years, their electrical

characteristics should be tested and their leads should be tested for ease

of soldering before they are used.

Humidity:

Temperature:

TMP93CS41DF 数据表(PDF) 32 Page - Toshiba Semiconductor

TMP93CS41DF 数据表(HTML) 32 Page - Toshiba Semiconductor

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

数据表下载