数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

TMP93CS41DF 数据表(PDF) 8 Page - Toshiba Semiconductor

部件名 TMP93CS41DF
功能描述  Quality And Reliability Assurance / Handling Precautions
PDF  48 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TOSHIBA [Toshiba Semiconductor]
网页  http://www.semicon.toshiba.co.jp/eng
标志 TOSHIBA - Toshiba Semiconductor

TMP93CS41DF 数据表(HTML) 8 Page - Toshiba Semiconductor

Back Button TMP93CS41DF Datasheet HTML 4Page - Toshiba Semiconductor TMP93CS41DF Datasheet HTML 5Page - Toshiba Semiconductor TMP93CS41DF Datasheet HTML 6Page - Toshiba Semiconductor TMP93CS41DF Datasheet HTML 7Page - Toshiba Semiconductor TMP93CS41DF Datasheet HTML 8Page - Toshiba Semiconductor TMP93CS41DF Datasheet HTML 9Page - Toshiba Semiconductor TMP93CS41DF Datasheet HTML 10Page - Toshiba Semiconductor TMP93CS41DF Datasheet HTML 11Page - Toshiba Semiconductor TMP93CS41DF Datasheet HTML 12Page - Toshiba Semiconductor Next Button
Zoom Inzoom in Zoom Outzoom out
 8 / 48 page
background image
Quality and Reliability Assurance / Handling Precautions
030901
QUA-8
2002-02-20
2.1.1
Precaution for Dry Pack
Figure 2.2 shows the tray type of the dry
pack form. Precaution for handling dry pack
products are as follows.
x Do not toss or drop to avoid damaging the
devices and/or the moisture proof bag.
y Desiccant in the form of granulated silica
gel includes blue indicator beads which
become transparent when moisture is
present, such as if the bag is torn or opened.
In this case, the devices must be high
temperature baked to remove the moisture
prior to solder mounting.
z Store the pack at 30°C / 90%RH. After
opening the pack mount it the device within
12 months of the date on the seal. If the
30% humidity indicator is entirely pink
when the device unpacked, or when the 12-
month duration has expired treat the
device before use at high temperature (bake
it at more than 125
°C for 20h) to remove
moisture.
{ How quickly a product should be used after
the pack is opened depends of the product.
See Tables 2-2 and 2-3 for details.
If the
time limit for use has expired when devices
are unpacked, they should be baked.
| Devices in heat-proof trays should be baked
at 125
°C for at least 20h.
Heat-proof trays bear the mold marking
“HEAT PROOF” .
Be careful not to bend the leads when
baking devices.
} Binding trays using a plastic tapes
If trays are rebound with plastic tapes after
having been untied, two tapes should be
used as shown in Figure 2.2 (a). If a tape is
tied lengthwise along the trays the tray
edges may break.
Figure 2.2
SMDs Dry pack Form
(a) Method
Heat-proof tray (occasionally non-heat-proof)
Moisture proof bag
(Aluminum laminate)
Heat proof tray
Corrugated
cardboard box
Heat seal
Turn under
Label
Plastic band
Indicator
Silica gel
IC
(b) Shipping carton
Sealing tape
Corrugated
cardboard box



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com