TMP93CS41DF datasheet(31/48 Pages) TOSHIBA

31 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-31

2002-02-20

4.1.2

Vibration, Impact and Stress

Handle devices and packaging materials with care.

To avoid damage to devices, do not toss or drop

packages. Ensure that devices are not subjected to

mechanical vibration or shock during

transportation. Ceramic package devices and

devices in canister-type packages which have

empty space inside them are subject to damage

from vibration and shock because the bonding wires are secured only at their

ends.

Plastic molded devices, on the other hand, have a relatively high level of

resistance to vibration and mechanical shock because their bonding wires are

enveloped and fixed in resin. However, when any device or package type is

installed in target equipment, it is to some extent susceptible to wiring

disconnections and other damage from vibration, shock and stressed solder

junctions. Therefore when devices are incorporated into the design of

equipment which will be subject to vibration, the structural design of the

equipment must be thought out carefully.

If a device is subjected to especially strong vibration, mechanical shock or

stress, the package or the chip itself may crack. In products such as CCDs

which incorporate window glass, this could cause surface flaws in the glass or

cause the connection between the glass and the ceramic to separate.

Furthermore, it is known that stress applied to a semiconductor device

through the package changes the resistance characteristics of the chip because

of piezoelectric effects. In analog circuit design attention must be paid to the

problem of package stress as well as to the dangers of vibration and shock as

described above.

Vibration

TMP93CS41DF 数据表(PDF) 31 Page - Toshiba Semiconductor