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TMP93CS41DF 数据表(PDF) 29 Page - Toshiba Semiconductor |
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TMP93CS41DF 数据表(HTML) 29 Page - Toshiba Semiconductor |
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29 / 48 page ![]() Quality and Reliability Assurance / Handling Precautions 030901 QUA-29 2002-02-20 (5) Pay attention to the following points when using automatic equipment in your workplace: (a) When picking up ICs with a vacuum unit, use a conductive rubber fitting on the end of the pick-up wand to protect against electrostatic charge. (b) Minimize friction on IC package surfaces. If some rubbing is unavoidable due to the device’s mechanical structure, minimize the friction plane or use material with a small friction coefficient and low electrical resistance. Also consider the use of an ionizer. (c) In sections that come into contact with device lead terminals, use a material which dissipates static electricity. (d) Ensure that no statically charged bodies (such as work clothes or the human body) touch the devices. (e) Make sure that sections of the tape carrier which come into contact with installation devices or other electrical machinery are made of a low-resistance material. (f) Make sure that jigs and tools used in the assembly process do not touch devices. (g) In processes in which packages may retain an electrostatic charge, use an ionizer to neutralize the ions. (6) Make sure that CRT displays in the working area are protected against static charge, for example by a VDT filter. As much as possible, avoid turning displays on and off. Doing so can cause electrostatic induction in devices. (7) Keep track of charged potential in the working area by taking periodic measurements. (8) Ensure that work chairs are protected by an anti-static textile cover and are grounded to the floor surface by a grounding chain. (Suggested resistance between the seat surface and grounding chain is 7.5 × 105 to 1012 Ω.) (9) Install anti-static mats on storage shelf surfaces. (Suggested surface resistivity is 10 4 to 108 Ω/sq; suggested resistance between surface and ground is 7.5 × 105 to 108 Ω.) (10) For transport and temporary storage of devices, use containers (boxes, jigs or bags) that are made of anti-static materials or materials which dissipate electrostatic charge. (11) Make sure that cart surfaces which come into contact with device packaging are made of materials which will conduct static electricity, and verify that they are grounded to the floor surface via a grounding chain. (12) In any location where the level of static electricity is to be closely controlled, the ground resistance level should be Class 3 or above. Use different ground wires for all items of equipment which may come into physical contact with devices. |
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