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STNRGPF01 数据表(PDF) 37 Page - STMicroelectronics |
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STNRGPF01 数据表(HTML) 37 Page - STMicroelectronics |
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37 / 40 page ![]() DocID030377 Rev 2 37/40 STNRGPF01 Package information 40 Table 19. TSSOP38 package mechanical data(1) 1. “TSSOP” stands for “Thin Shrink Small Outline Package”. Symbol Dimensions (mm) Min. Typ. Max. A- - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 b 0.17 - 0.27 c 0.09 - 0.20 D(2) 2. “Dimensions “D” and “E1”do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 9.60 9.70 9.80 E 6.20 6.40 6.60 E1(2) 4.30 4.40 4.50 e - 0.50 - L 0.45 0.60 0.75 L1 - 1.00 - k0 - 8 aaa - - 0.10 |
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