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SRC0 数据表(PDF) 38 Page - STMicroelectronics |
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SRC0 数据表(HTML) 38 Page - STMicroelectronics |
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38 / 48 page ![]() Maximum ratings SRC0 38/48 DocID026008 Rev 2 6 Maximum ratings Stressing the device above the rating listed inTable 3 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in Table 4 of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute maximum ratings Symbol Parameter Min. Max. Unit Remarks VCC Input supply voltage –0.3 +7.0 V Input voltages on PB, SR, PSHOLD and CSRD –0.3 VCC + 0.3 V Output voltages on EN (EN), RST and INT –0.3 VCC + 0.3 V VESD Electrostatic protection –2 +2 kV Human body model (all pins) –8 +8 kV Human body model (PB and SR) VESD Electrostatic protection –1000 +1000 V Charged device model VESD Electrostatic protection –200 +200 V Machine model VESD Point discharge on PB and SR inputs –8 +8 kV IEC61000-4-2 VESD Air discharge on PB and SR inputs –15 +15 kV IEC61000-4-2 TA Operating ambient temperature –40 +85 °C TSTG Storage temperature –45 +150 °C TSLD (1) Lead solder temperature for 10 seconds +260 °C JA Thermal resistance (junction to ambient) +132.4 °C/W 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds. |
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