STM8L151C4 datasheet(8/142 Pages) STMICROELECTRONICS

8 / 142 page

List of figures

STM8L151x4/6, STM8L152x4/6

8/142

DocID15962 Rev 15

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Figure 47.

UFQFPN48 - 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Figure 48.

UFQFPN48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

Figure 49.

LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 123

Figure 50.

LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

Figure 51.

LQFP32 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

Figure 52.

UFQFPN32 - 32-pin, 5 x 5 mm, 0.5 mm pitch ultra thin fine pitch quad flat

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Figure 53.

UFQFPN32 - 32-pin, 5 x 5 mm, 0.5 mm pitch ultra thin fine pitch quad flat

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Figure 54.

UFQFPN32 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

Figure 55.

UFQFPN28 - 28-lead, 4 x 4 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

Figure 56.

UFQFPN28 - 28-lead, 4 x 4 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Figure 57.

UFQFPN28 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

Figure 58.

WLCSP28 - 28-pin, 1.703 x 2.841 mm, 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

Figure 59.

WLCSP28 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

Figure 60.

Medium-density STM8L15x ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . 136

STM8L151C4 数据表(PDF) 8 Page - STMicroelectronics

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