STM8L151C4 datasheet(133/142 Pages) STMICROELECTRONICS

133 / 142 page

DocID15962 Rev 15

133/142

STM8L151x4/6, STM8L152x4/6

Package information

136

Device marking

The following figure gives an example of topside marking orientation versus ball A1 identifier

location. Other optional marking or inset/upset marks, which depend on supply chain

operations, are not indicated below.

Table 67. WLCSP28 - 28-pin, 1.703 x 2.841 mm, 0.4 mm pitch wafer level chip scale

package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.540

0.570

0.600

0.0213

0.0224

0.0236

0.190

0.0075

0.380

0.0150

b(2)

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.240

0.270

0.300

0.0094

0.0106

0.0118

1.668

1.703

1.738

0.0657

0.0670

0.0684

2.806

2.841

2.876

0.1105

0.1119

0.1132

0.400

0.0157

1.200

0.0472

2.400

0.0945

0.251

0.0099

0.222

0.0087

aaa

0.100

0.0039

bbb

0.100

0.0039

ccc

0.100

0.0039

ddd

0.050

0.0020

eee

0.050

0.0020

STM8L151C4 数据表(PDF) 133 Page - STMicroelectronics

STM8L151C4 数据表(HTML) 133 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

数据表下载

链接网址

STM8L151C4 数据表(PDF) 133 Page - STMicroelectronics

STM8L151C4 数据表(HTML) 133 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

数据表 下载

链接网址

数据表下载