Prepared by JM Bugnard

Page 5/9

Process Change/ Transfer

Qualification report n° QASO8N91

2.6 RELIABILITY QUALIFICATION REQUIREMENTS

[x] yes

[] no

2.6.1 Reliability tests performed on

[x] LotA [x] LotB

[x] LotC

2.6.2 Reliability tests:

Tests

Conditions

Test

LotA LotB LotC

Comments

HTB

Ta=125°C

Vs=absolute max

rating

1000h

X

X

X

Purpose: to point out problems connected

to electrical stress related with the field

application condition

Environment

Sequence

PPT 3 atm. +

TMC

48h

100 cy.

X

X

X

THB

Ta=85C RH=85pct

Vs=nominal

1000h

X

X

X

Purpose: To point out failure mechanism

mainly due to electrochemical effects

developped inside the device for

contamination ions and electrical field

applied

TMC

Ta= -65/+150C

1000c

X

X

X

Purpose: to point out the

thermomechanical mismatch among the

different materials employed

PPT

Ta=121°C P=2atm

480h

X

X

X

Purpose: to point out critical water entry

path with consequential electrolytic and

galvanic corrosion.

Jedel level

determination

Jedel level 1

168h 85°C /

85%RH + 3IR

reflow soldering

X*

X**

X**

Purpose: To point out problem connected

to the reflow soldering.

TMSK

Ta= -65/+150C

500shk

X

X

Purpose: to point out the

thermomechanical mismatch among the

different materials employed

* With 260°C reflow peak (see Appendix 1)

** With 245°C reflow peak (see Appendix 1)

2.6.3 Drift analysis on Vio parameter (HTB & THB)

[x yes

[ ] no

2.6.4 Qu alification criteria:

no reject after reliability.