Prepared by JM Bugnard

Page 3/9

Process Change/ Transfer

Qualification report n° QASO8N91

1.1.1 Nature of Change: Leadfree plating NiPdAu preplated leadframe and glue change (Hitachi

4900)

1.1.2

Reason for Change: To be compliant with Environmental directives.

1.1.3

Affected process: SO8 assembled in ST Muar

1.1.4

Affected products: All standard linear devices assembled in SO8

1.1.5

Implementation date: April 2003

1.2 DETAILLED DESCRIPTION OF CHANGE

New Process

Current Process

Assembly site

ST Muar (Malaysia)

ST Muar (Malaysia)

Assembly flow + Control Plan

7124337

7071671

Frame (material)

Copper +

NiPdAu preplating

Copper

Die attach material

Hitachi 4900ST

Ablebond 8390

Wire material

Wire diameter

Gold

1 MIL

Gold

1 MIL

Mold compound

MP8000 CH4

MP8000 CH4

Wire bond method

Thermosonic

Thermosonic

Lead finishing

NiPdAu (preplated)

Tin plating (SnPb85/15)

LEAD-FREE components are defined by STMicroelectronics as ECOPACK® components.

The implementation of the ECOPACK specification includes the suppression of lead (Pb) in those alloys used

the lead finishing of components.

The identification of ECOPACK products will be achieved through specific labelling on

component boxes.

Whenever possible, the letter “E” will be added in the marking pattern beside the ST logo on the package

body.

1.3 MAJOR EFFECTS OF CHANGE ON QUALITY, PARAMETRIC, ELECTRICAL OR

RELIABILITY DATA

free PCB assembly processes.

in SO Narrow in order to meet the higher soldering tem perature constraints required for lead-free soldering using,

in particular, the IPC/JEDEC JSTD020B

standard as re ference.