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145 数据表(PDF) 3 Page - STMicroelectronics |
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145 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 12 page ![]() Prepared by JM Bugnard Page 1/9 Process Change/ Transfer Qualification report n° QASO8N91 Reference documents: SOP 2.5.9 Process critical and key parameters 0076604 Process Qualification and release to production 0078588 Reliability requirements for product qualification 0046008 Process control plan for Front End 0060531 FMEA procedure 0061050 Back end qualification procedure 0091984 Construction analysis 0037709 Package construction analysis 7006451 Management of manufacturing source change 0033689 Process flow chart PROCESS CHANGE / TRANSFER QUALIFICATION REPORT PCN reference: DSG-COM/03/145 Qualification Report n°: QASO8N91 Qualification Type: Material change Process: Leadfree plating New glue Hitachi 4900 Date of issue: 22th January 2003 |
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