PIC12CE673 datasheet(103/116 Pages) MICROCHIP

103 / 116 page

Preliminary

DS40181B-page 103

PIC12CE67X

14.0

PACKAGING INFORMATION

14.1

Package Marking Information

Legend: MM...M

Microchip part number information

XX...X

Customer speciﬁc information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Facility code of the plant at which wafer is manufactured

O = Outside Vendor

C = 5” Line

S = 6” Line

H = 8” Line

Mask revision number

Assembly code of the plant or country of origin in which

part was assembled

Note:

In the event the full Microchip part number cannot be marked on one line,

it will be carried over to the next line thus limiting the number of available

characters for customer speciﬁc information.

Standard OTP marking consists of Microchip part number, year code, week

code, facility code, mask rev#, and assembly code.

For

OTP marking

beyond this, certain price adders apply. Please check with your Microchip

Sales Ofﬁce. For QTP devices, any special marking adders are included in

QTP price.

MMMMMMMM

XXXXXCDE

AABB

8-Lead PDIP (300 mil)

Example

8-Lead Windowed Ceramic Side Brazed (300 mil)

Example

12CE674

04/PSAZ

9725

CE674

MMMMMM

PIC12CE673 数据表(PDF) 103 Page - Microchip Technology

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