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PIC12CE673 数据表(PDF) 105 Page - Microchip Technology |
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PIC12CE673 数据表(HTML) 105 Page - Microchip Technology |
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105 / 116 page ![]() © 1998 Microchip Technology Inc. Preliminary DS40181B-page 105 PIC12CE67X Package Type: K04-084 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil n 1 2 0.260 0.440 0.161 0.310 0.280 0.510 0.130 0.025 0.103 0.145 0.008 0.050 0.016 0.098 MIN Window Diameter Overall Row Spacing Package Length Tip to Seating Plane Base to Seating Plane Top of Body to Seating Plane Top to Seating Plane Upper Lead Width Lower Lead Width PCB Row Spacing Dimension Limits Lid Length Lid Width Package Width Lead Thickness Number of Pins Pitch Units T U D W eB E A2 A1 L B A c B1 p n 0.450 0.270 0.520 0.166 0.338 0.290 0.140 0.035 0.123 0.460 0.280 0.171 0.365 0.300 0.530 0.150 0.045 0.143 8 NOM 0.018 0.165 0.010 0.055 0.100 0.300 MAX 0.185 0.012 0.060 0.020 0.102 6.86 11.43 4.22 8.57 7.37 13.21 3.56 0.89 3.12 11.18 6.60 12.95 4.09 7.87 7.11 3.30 0.64 2.62 11.68 7.11 13.46 4.34 9.27 7.62 3.81 1.14 3.63 4.19 0.25 1.40 0.46 2.54 7.62 NOM MILLIMETERS MIN 0.41 3.68 0.20 1.27 2.49 MAX 8 0.51 4.70 0.30 1.52 2.59 D T E U W c eB L A1 B B1 A A2 p INCHES* * Controlling Parameter. |
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