MB9BF412RPMC-G-JNE2 datasheet(108/112 Pages) CYPRESS

108 / 112 page

Document Number: 002-05615 Rev. *D

Page

108 of 112

MB9B410R Series

Package Type

Package Code

FBGA 112

LBC112

N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW,

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW,

DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.

"SD" AND "SE" ARE MEASUREDWITH RESPECT TO DATUMS A AND B AND

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.

"e" REPRESENTS THE SOLDER BALL GRID PITCH.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A

SOLDER BALL POSITION DESIGNATIO

N PER JEP95, SECTION 3, SPP-020.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED SOLDER

A1 CORNER TO BE IDENTIFIED BY

CHAMFER, LASER OR INK MARK

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

0.35

0.00

0.80 BSC

0.45

112

0.55

DIMENSIONS

SYMBOL

0.25

MIN.

8.00 BSC

10.00 BSC

NOM.

1.45

0.45

MAX.

0.00

0.35

METALIZED MARK, INDENTATION OR OTHER MEANS.

"SD" = eD/2 AND "SE" = eE/2.

PLANE PARALLEL TO DATUM C.

"SD" OR "SE" = 0.

SIZE MD X ME.

BALLS.

0.20 C

INDEX MARK

PIN A1

CORNER

112x

φb

0.08

C A B

SIDE VIEW

0.10 C

DETAIL A

BOTTOM VIEW

TOP VIEW

DETAIL A

10.00X10.00X1.45 MM LBC112 REV**

PACKAGE OUTLINE, 112 BALL FBGA

002-13225 **

MB9BF412RPMC-G-JNE2 数据表(PDF) 108 Page - Cypress Semiconductor

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