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SSM2518CPZ-R7 数据表(PDF) 47 Page - Analog Devices |
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SSM2518CPZ-R7 数据表(HTML) 47 Page - Analog Devices |
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47 / 48 page ![]() Datasheet SSM2518 Rev. B | Page 47 of 48 PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS A B C D 0.660 0.600 0.540 SIDE VIEW 0.270 0.240 0.210 0.360 0.320 0.280 COPLANARITY 0.05 SEATING PLANE 1 2 3 4 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) BALL 1 IDENTIFIER 0.50 REF 1.50 REF 2.250 2.210 SQ 2.170 Figure 37.16-Ball Wafer Level Chip Scale Package [WLCSP] (CB-16-13) Dimensions shown in millimeters 0.50 BSC 0.50 0.40 0.30 0.30 0.25 0.18 COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-11. 4.10 4.00 SQ 3.90 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.20 REF 0.20 MIN COPLANARITY 0.08 PIN 1 INDICATOR 2.75 2.60 SQ 2.35 1 20 6 10 11 15 16 5 BOTTOM VIEW TOP VIEW SIDE VIEW FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. EXPOSED PAD SEATING PLANE PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) DETAIL A (JEDEC 95) Figure 38. 20-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.75 mm Package Height (CP-20-8) Dimensions shown in millimeters |
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