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FUSB302MPX. 数据表(PDF) 1 Page - ON Semiconductor |
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FUSB302MPX. 数据表(HTML) 1 Page - ON Semiconductor |
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1 / 35 page ![]() July 2017 © 2015 Semiconductor Components Industries, LLC. www.fairchildsemi.com FUSB302 • Rev. 2 www.onsemi.com FUSB302 Programmable USB Type-C Controller w/PD Features Dual-Role Functionality with Autonomous DRP Toggle Ability to connect as either a host or a device based on what has been attached. Software configurable either as a dedicated host, dedicated device, or dual role. - Dedicated devices can operate both on a Type-C receptacle or a Type-C plug with a fixed CC and VCONN channel. Full Type-C 1.1 Support. Integrates the following functionality of the CC pin - Attach/Detach Detection as Host - Current Capability Indication as Host - Current Capability Detection as Device - Audio Adapter Accessory Mode - Debug Accessory Mode - Active Cable Detection Integrates CCx to VCONN switch with over-current limiting for powering USB3.1 Full Featured cables. USB Power Delivery (PD) 2.0, Version 1.1 Support - Automatic GoodCRC Packet Response - Automatic retries of sending a packet if a GoodCRC is not received - Automatic soft reset packet sent with retries if needed - Automatic Hard Reset Ordered Set Sent Dead Battery Support (SNK Mode Support when No Power Applied) Low Power Operation: I CC = 25 μA (Typical) Packaged in 9-Ball WLCSP (1.215 mm x 1.260 mm) and 14-lead MLP (2.5 mm x 2.5 mm, 0.5 mm Pitch) Description The FUSB302 targets system designers looking to implement a DRP/SRC/SNK USB Type-C connector with low amount of programmability. The FUSB302 enables the USB Type-C detection including attach, and orientation. The FUSB302 integrates the physical layer of the USB BMC power delivery protocol to allow up to 100 W of power and role swap. The BMC PD block enables full support for alternative interfaces of the Type-C specification. Applications Smartphones Tablets Laptops Notebooks Power Adapters Cameras Dongles Figure 1. Block Diagram Ordering Information Part Number Operating Temperature Range Package Packing Method FUSB302UCX -40 to 85°C 9-Ball Wafer-Level Chip Scale Package (WLCSP), 0.4 mm Pitch Tape and Reel FUSB302MPX 14-Lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch |
类似零件编号 - FUSB302MPX. |
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类似说明 - FUSB302MPX. |
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