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FUSB302MPX. 数据表(PDF) 1 Page - ON Semiconductor

部件名 FUSB302MPX.
功能描述  Programmable USB Type-C Controller w/PD
PDF  35 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

FUSB302MPX. 数据表(HTML) 1 Page - ON Semiconductor

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July 2017
© 2015 Semiconductor Components Industries, LLC.
www.fairchildsemi.com
FUSB302 • Rev. 2
www.onsemi.com
FUSB302
Programmable USB Type-C Controller w/PD
Features
Dual-Role Functionality with Autonomous DRP
Toggle
Ability to connect as either a host or a device based
on what has been attached.
Software configurable either as a dedicated host,
dedicated device, or dual role.
- Dedicated devices can operate both on a Type-C
receptacle or a Type-C plug with a fixed CC and
VCONN channel.
Full Type-C 1.1 Support. Integrates the following
functionality of the CC pin
- Attach/Detach Detection as Host
- Current Capability Indication as Host
- Current Capability Detection as Device
- Audio Adapter Accessory Mode
- Debug Accessory Mode
- Active Cable Detection
Integrates CCx to VCONN switch with over-current
limiting for powering USB3.1 Full Featured cables.
USB Power Delivery (PD) 2.0, Version 1.1 Support
- Automatic GoodCRC Packet Response
- Automatic retries of sending a packet if a
GoodCRC is not received
- Automatic soft reset packet sent with retries if
needed
- Automatic Hard Reset Ordered Set Sent
Dead Battery Support (SNK Mode Support when
No Power Applied)
Low Power Operation: I
CC
= 25
μA (Typical)
Packaged in 9-Ball WLCSP (1.215 mm x
1.260 mm) and 14-lead MLP (2.5 mm x 2.5 mm,
0.5 mm Pitch)
Description
The FUSB302 targets system designers looking to
implement a DRP/SRC/SNK USB Type-C connector
with low amount of programmability.
The FUSB302 enables the USB Type-C detection
including
attach,
and
orientation.
The
FUSB302
integrates the physical layer of the USB BMC power
delivery protocol to allow up to 100 W of power and role
swap. The BMC PD block enables full support for
alternative interfaces of the Type-C specification.
Applications
Smartphones
Tablets
Laptops
Notebooks
Power Adapters
Cameras
Dongles
Figure 1.
Block Diagram
Ordering Information
Part Number
Operating
Temperature Range
Package
Packing
Method
FUSB302UCX
-40 to 85°C
9-Ball Wafer-Level Chip Scale Package (WLCSP),
0.4 mm Pitch
Tape and Reel
FUSB302MPX
14-Lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch


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