GD5F2GQ4RF9JS datasheet(55/57 Pages) GIGADEVICE

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SPI(x1/x2/x4) NAND Flash

23 REVISION HISTORY

Version No

Description

Date

Page

1.0

Initial Release

2017-07-03

1.1

Add parameter page CRC value

2017-07-14

1.2

Modify Package TFBGA-24BALL (6*8 ball array)

Delete Package WSON8 (6*8mm) & SOP16 300MIL

2017-7-20

1.3

Modify the Number of Figure and Table

Modify Package ‘R’ description

Reduce the size of parameter page device model table

Modify TFBGA-24BALL description

Modify Read CID command sequence description

2017-9-1

1.4

Delete Package WSON8 in ORDERING INFORMATION

2017-9-26

1.5

Add the Note article 4 of Page Program

2017-10-23

1.6

Add the chapter of Valid Part Numbers

2017-11-03

1.7

Add the description of 2Gb SLC NAND Flash

Add the description of Reliability

Modify the Figure of Program Load Sequence Diagram typo

Modify the package of LGA8

2017-12-11

1.8

Modify the package of TFBGA24

Modify the typo of LGA8

2017-12-27

1.9

Add LGA8 package description for hardware reset section

2018-1-16

2.0

Modify some typo

Add Temperature Range J:Industrial(-40

℃ to 105℃) and related

description

Change Memory Mapping CA from<12:0> to <11:0>

Add byte1 and byte2 for two Device ID in Read Sequence Diagram

Add page size 2048bytes + 64bytes with ECC enabled

Modify figures11-1,11-2,11-4,11-5,11-6 from Byte 2175 to 2175/2111

and add a note to explain

Change Parameter page table Byte 105-106 and 108-109,and

change CRC Value

Merge chapters 2.1 and 21.1

Change the description of protection with WP# Pin

2018-2-13

2.1

Add Temperature Range F:Industrial+ (-40

℃ to 85℃)

2018-3-12

2.2

Modify the Value of Applied Input/ Output Voltage and VCC in

Chapter16

Modify the description of LGA8 6*8mm package

Update Ordering Information

2018-7-25

2.3

Modify the file name

Update the ordering information

2018-10-22

2.4

Add Note describe the spare size with Internal ECC ON.

2019-3-25

4/9

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