ADN2525

Rev. 0 | Page 4 of 16

THERMAL SPECIFICATIONS

Table 2.

Parameter

Min

Typ

Max

Unit

Conditions/Comments

2.6

5.8

10.7

°C/W

Thermal resistance from junction to bottom of exposed pad.

65

72.2

79.4

°C/W

Thermal resistance from junction to top of package.

IC Junction Temperature

125

°C

90%

10%

ALS

IBIAS

AND IMOD

ALS

ASSERT TIME

ALS

NEGATE TIME

t

t

Figure 2. ALS Timing Diagram

MSET

NC1

ALS

GND

BSET IBMON IBIAS

GND

VCC

IMODP

IMODN

VCC

10nF

10nF

J8

J5

VEE

VEE

TP1

10nF

ADN2525

22

µF

VEE

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

50

Ω

50

Ω

OSCILLOSCOPE

BIAS TEE: Picosecond Pulse Labs Model 5542-219

Adapter: Pasternack PE-9436 2.92mm female-to-female adapter

Attenuator: Pasternack PE-7046 2.92mm 20dB attenuator

ADAPTER

VBSET

1k

Ω

VEE

VEE

VMSET

GND

GND

GND

TP2

10

Ω

70

Ω

35

Ω

35

Ω

10nF

GND

VEE

J2

GND

GND

GND

GND

VCC

VCC

DATAN

DATAP

GND

GND

GND

J3

GND

GND

BIAS TEE

BIAS TEE

ADAPTER

ATTENUATOR

ATTENUATOR

Figure 3. High Speed Characterization Circuit