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ADN2525ACPZ-R2 数据表(PDF) 12 Page - Analog Devices |
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ADN2525ACPZ-R2 数据表(HTML) 12 Page - Analog Devices |
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12 / 16 page ![]() ADN2525 Rev. 0 | Page 12 of 16 LOAD MIS-TERMINATION Due to its excellent S22 performance, the ADN2525 can drive differential loads that range from 5 Ω to 50 Ω. In practice, many TOSAs have differential resistance less than 50 Ω. In this case, with 50 Ω differential transmission lines connecting the ADN2525 to the load, the load end of the transmission lines are mis-terminated. This mis-termination leads to signal reflections back to the driver. The excellent back-termination in the ADN2525 absorbs these reflections, preventing their reflection back to the load. This enables excellent optical eye quality to be achieved, even when the load end of the transmission lines is significantly mis-terminated. The connection between the load and the ADN2525 must be made with 50 Ω differential (25 Ω single-ended) transmission lines so that the driver end of the transmission lines is properly terminated. POWER CONSUMPTION The power dissipated by the ADN2525 is given by IBIAS V I V VCC P IBIAS SUPPLY MSET × + ⎟ ⎠ ⎞ ⎜ ⎝ ⎛ + × = 5 . 13 where: VCC is the power supply voltage. IBIAS is the bias current generated by the ADN2525. VMSET is the voltage applied to the MSET pin. ISUPPLY is the sum of the current that flows into the VCC, IMODP, and IMODN pins of the ADN2525 when IBIAS = IMOD = 0 expressed in amps (see Table 1). VIBIAS is the average voltage on the IBIAS pin. Considering VBSET/IBIAS = 10 as the conversion factor from VBSET to IBIAS, the dissipated power becomes IBIAS BSET SUPPLY MSET V V I V VCC P × + ⎟ ⎠ ⎞ ⎜ ⎝ ⎛ + × = 10 5 . 13 To ensure long-term reliable operation, the junction tempera- ture of the ADN2525 must not exceed 125°C, as specified in Table 2. For improved heat dissipation, the module’s case can be used as heat sink as shown in Figure 31. A compact optical module is a complex thermal environment, and calculations of device junction temperature using the package θJA (junction-to- ambient thermal resistance) do not yield accurate results. TTOP TJ TPAD DIE PACKAGE THERMAL COMPOUND MODULE CASE PCB VIAS COPPER PLANE THERMO-COUPLE Figure 31. Typical Optical Module Structure The following procedure can be used to estimate the IC junction temperature: TTOP = Temperature at top of package in °C. TPAD = Temperature at package exposed paddle in °C. TJ = IC junction temperature in °C. P = Power dissipation in W. θJ-TOP = Thermal resistance from IC junction to package top. θJ-PAD = Thermal resistance from IC junction to package exposed pad. P θ J-TOP TPAD TTOP TTOP θ J-PAD TPAD Figure 32. Electrical Model for Thermal Calculations TTOP and TPAD can be determined by measuring the temperature at points inside the module as shown in Figure 31. The thermo- couples should be positioned to obtain an accurate measurement of the package top and paddle temperatures. Using the model shown in Figure 32, the junction temperature can be calculated using the following formula: ( ) TOP J PAD J TOP J PAD PAD J TOP TOP J PAD J J T T P T − − − − − − θ + θ θ × + θ × + θ × θ × = where θJ-TOP and θJ-PAD are given in Table 2 and P is the power dissipated by the ADN2525. |
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