AT21CS01 datasheet(39/47 Pages) MICROCHIP

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AT21CS01 [DATASHEET]

Atmel-8903A-SEEPROM-AT21CS01-Datasheet_082015

12.2 3ST1 — 3-lead SOT23

TITLE

DRAWING NO.

GPC

REV.

3TS1

12/11/09

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

End View

Side View

Top View

3TS1, 3-lead, 1.30mm Body, Plastic Thin

Shrink Small Outline Package (Shrink SOT)

TBG

0.89

0.01

0.88

2.80

2.10

1.20

0.30

2.90

1.30

0.54 REF

1.90 BSC

1.12

0.10

1.02

3.04

2.64

1.40

0.50

1,2

Notes:

1. Dimension D does not include mold flash, protrusions or gate

burrs. Mold flash, protrusions or gate burrs shall not exceed

0.25mm per end. Dimension E1 does not include interlead flash

or protrusion. Interlead flash or protrusion shall not exceed

0.25mm per side.

2. The package top may be smaller than the package bottom.

Dimensions D and E1 are determined at the outermost extremes

of the plastic body exclusive of mold flash, tie bar burrs, gate

burrs and interlead flash, but including any mismatch between

the top and bottom of the plastic body.

3. These dimensions apply to the flat section of the lead between

0.08 mm and 0.15mm from the lead tip.

This drawing is for general information only. Refer to JEDEC

Drawing TO-236, Variation AB for additional information.

SEATING

PLANE

GND

SDA

VCC

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging.

AT21CS01/AT21CS11

Datasheet

DS20005857A-page 39

AT21CS01 数据表(PDF) 39 Page - Microchip Technology

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