ADPA1105

Data Sheet

Rev. 0 | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

55 V dc

−5 V to 0 V dc

Radio Frequency Input Power (RFIN)

30 dBm

Maximum Drain Bias

Pulse Width

500 μs

Duty Cycle

20%

Drain Bias Pulse Width = 100 μs at 10% Duty Cycle

473 mW/°C Above 85°C

54.5 W

Nominal Pulsed Peak Channel Temperature,

155.9°C

Drain Bias Pulse Width = 200 μs at 20% Duty Cycle

355 mW/°C Above 85°C)

40.8 W

Nominal Pulsed Peak Channel Temperature

179.7°C

Maximum Channel Temperature

200°C

Maximum Peak Reflow Temperature

260°C

Storage Temperature Range

−60°C to

+125°C

Operating Temperature Range

−40°C to +85°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any

other conditions above those indicated in the operational section

of this specification is not implied. Operation beyond the

maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

the PCB thermal design is required.

Table 4. Thermal Resistance

Unit

CG-32-2

2.11

°C/W

2.82

°C/W

conditions: the heat transfer is solely because of the thermal conduction

from the channel through the ground pad to the PCB, and the ground pad is

held constant at the operating temperature of 85°C.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADPA1105

Table 5. ADPA1105, 32-Lead LFCSP_CAV

ESD Model

Withstand Threshold (V)

Class

HBM

250

1A

ESD CAUTION