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LTM4656 数据表(PDF) 4 Page - Analog Devices |
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LTM4656 数据表(HTML) 4 Page - Analog Devices |
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4 / 28 page ![]() LTM4656/LTM4656-1 4 Rev. 0 For more information www.analog.com SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VRUN RUN Pin ON Threshold VRUN Rising 1.18 1.28 1.38 V VRUNHYS RUN Pin ON Hysteresis 100 mV In-Line Protection Control Section SHDN Active Low Shutdown 4V to 36V Input Threshold l 0.6 0.385 1.4 1.7 2.1 V V SHDN Reset SHDN Reset Time SHDN = 0.4V (Note 6) 100 µs UV Threshold Undervoltage Lockout UV Lockout Threshold, VIN =12V l 1.24 1.275 1.31 V UV Hysteresis UV Input Hysteresis VIN > 4.5V, Nominal 12V (Note 6) 12 mV UV IN UV Input Current UV =1 .275V (Note 6) l ±0.3 ±1 µA VTMR(F) TMR Fault Threshold TMR Rising (Note 6) 1.275 V VTMR(G) TMR Gate Off Threshold TMR Rising 1.375 V VTMR(H) TMR Cooldown High Threshold VIN = 12V to 24V, TMR Rising 4.3 V TMR OVER I (5V) TMR Overcurrent tVDS = 5V VIN, SHDN, UV = 5V, VFB = 24.3k, 12V VOUT Shorted 800 µs TMR OVER I (12V) TMR Overcurrent tVDS = 12V VIN, SHDN, UV =12V, VFB = 11.5k, 24V VOUT Shorted 220 µs TMR OVER I (24V) TMR Overcurrent tVDS = 24V VIN, SHDN, UV = 24V, VFB = 7.5k, 36V VOUT Shorted 150 µs ILEAK(FLT) FLT Pin Leak FLT = 36V l ±2.5 µA VIN – BVIN Rising Delta Path Fully Enhanced Delta VIN – BVIN Enhancing, Boost RUN Pin Enabled l 0.25 0.5 0.75 V VIN – BVIN Falling Delta Path Being Opened Delta VIN – BVIN Opening, Boost RUN Pin Pulled Low 2.7 V DC Retry Duty Cycle, Shorted Output VIN = 12V, VOUT = 0V, Referenced to BVIN 1 % tOFF(UV) Undervoltage Turn-Off Propagation Delay UV Steps from 1.5V to 1V (Note 6) l 2 5 µs VOL(FLT) FLT Output Low ISINK =100µA l 0.3 0.8 V PGOOD Output VPGL PGOOD Voltage Low IPGOOD = 2mA 0.3 V IPGOOD(LEAK) PGOOD Leakage Current VPGOOD = 6V ±1 μA VPG PGOOD Trip Level VFB with Respect to Set Regulated Voltage VFB Ramping Negative VFB Ramping Positive –12 8 –10 10 –8 12 % % ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified operating temperature range, otherwise specifications are at TA = 25°C. (Note 2), VIN = 12, VBIAS = BVIN, SHDN = VIN per the typical application, or otherwise specified in the table. Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTM4656 is tested under pulsed load conditions such that TJ ≈ TA. The LTM4656E is guaranteed to meet performance specifications over the 0°C to 125°C internal operating temperature range. Specifications over the full –40°C to 125°C internal operating temperature range are assured by design, characterization and correlation with statistical process controls. The LTM4656I is guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. Note 3: The minimum on-time condition is specified for a peak-to- peak inductor ripple current of ~40% of IMAX Load. (See Applications Information section) Note 4: See output current derating curves for different VIN, VOUT and TA. Note 5: Guaranteed by design. Note 6: 100% tested at wafer level. Note 7: JEDEC board θ values are determined by simulation per JESD51 conditions. Demo board θ values are obtained with demo board. Refer to Figure 9 to Figure 17 and Table 2 to Table 5 for lab ameasurement and derating information. |
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