LTM4656/LTM4656-1

2

Rev. 0

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PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

RUN ............................................................. –0.3V to 5V

TMR......................................................................0.5mA

than 5mA (Current Source)

Operating Junction Temperature (Note 2).. –40 to 125°C

Storage Temperature Range ...................... –55 to 125°C

Peak Solder Reflow Body Temperature ................. 245°C

Note: Not recommended for upside-down reflow.

(Note 1)

1

A

B

C

D

E

F

G

H

J

K

L

M

2

3

4

5

6

7

TOP VIEW

8

9

10

11

12

GND

GND

GND

GND

BGA PACKAGE

144-LEAD (16mm × 16mm × 7.07mm)

WEIGHT = 4.22g

GND

GND

GND

GND

NC

SHDN

SENSE1

SW

RUN

UV

FLT

TMR

FREQ

MODE_PLLIN

ORDER INFORMATION

(See Capacitor Matrix, Pin Configuration Table)

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE TYPE

MSL RATING

TEMPERATURE 

RANGE (Note 2)

DEVICE

FINISH CODE

LTM4656EY#PBF

SAC305 (RoHS)

LTM4656Y

e1

BGA

4

−40°C to 125°C

LTM4656IY#PBF

SAC305 (RoHS)

e1

−40°C to 125°C

LTM4656IY

SnPb (63/37)

e0

−40°C to 125°C

LTM4656EY-1#PBF

SAC305 (RoHS)

e1

−40°C to 125°C

LTM4656IY-1#PBF

SAC305 (RoHS)

e1

−40°C to 125°C

LTM4656IY-1

SnPb (63/37)

e0

−40°C to 125°C

• Contact the factory for parts specified with wider operating temperature

ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings