ADPA7008CHIP

Data Sheet

Rev. 0 | Page 26 of 26

OUTLINE DIMENSIONS

3.610 SQ

*This die utilizes fragile air bridges. Any pickup tools used must not contact this area.

TOP VIEW

(CIRCUIT SIDE)

SIDE VIEW

1.194

0.888

0.08

0.126

0.126

0.642

0.787

0.770

0.624

0.888

1.068

3.270

0.260

*AIR BRIDGE

AREA

0.102

0.130

0.174

0.197

0.197

1.532

3.355

0.668

0.938

1.595

1.598

0.110

0.110

0.101

(Pads 2 - 4)

0.125

(Pads 1 and 6)

(Pads 4 and 8)

(Pads 2, 3, 5, 7, 9, 10)

0.101

(Pads 8 - 10)

0.117

(Pads 5 - 7)

Figure 68. 10-Pad Bare Die [CHIP]

(C-10-12)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADPA7008CHIP

−55°C to +85°C

10-Pad Bare Die [CHIP]

C-10-12

ADPA7008C-KIT

−55°C to +85°C

10-Pad Bare Die [CHIP]

C-10-12

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D25395-3/21(0)