ADPA7008CHIP datasheet(25/26 Pages) AD

25 / 26 page

Data Sheet

ADPA7008CHIP

Rev. 0 | Page 25 of 26

MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS

Attach the die directly to the ground plane with conductive

epoxy (see the Handling Precautions section, the Mounting

section, and the Wire Bonding section).

Place the microstrip substrates as close to the die as possible to

minimize ribbon bond length. Typical die to substrate spacing

is 0.076 mm to 0.152 mm (3 mil to 6 mil).

MMIC

3mil GOLD

RIBBON

3mil GA

RFIN

50Ω

TRANSMISSION LINE

Figure 66. High Frequency Input Wideband Matching

MMIC

3mil GOLD

RIBBON

3mil GA

RFOUT

50Ω

TRANSMISSION LINE

Figure 67. High Frequency Output Wideband Matching

HANDLING PRECAUTIONS

To avoid permanent damage, follow these storage, cleanliness,

static sensitivity, transient, and general handling precautions:



Place all bare die in either waffle- or gel-based ESD

protective containers and then seal the die in an ESD

protective bag for shipment. After the sealed ESD

protective bag is opened, store all die in a dry nitrogen

environment.



Handle the chips in a clean environment. Do not attempt

to clean the chips using liquid cleaning systems.



Follow ESD precautions to protect against ESD strikes.



While bias is applied, suppress instrument and bias supply

transients. Use shielded signal and bias cables to minimize

inductive pickup.



Handle the chip along the edges with a vacuum collet or

with a sharp pair of tweezers. The surface of the chip has

fragile air bridges and must not be touched with a vacuum

collet, tweezers, or fingers.

MOUNTING

Before the epoxy die is attached, apply a minimum amount of

epoxy to the mounting surface so that a thin epoxy fillet is

observed around the perimeter of the chip after it is placed into

position. Cure the epoxy per the schedule of the manufacturer.

WIRE BONDING

RF bonds made with 0.076 mm × 0.0127 mm (3 mil × 0. 5 mil)

gold ribbon are recommended for the RF ports. These bonds

must be thermosonically bonded with a force of 40 g to 60 g.

Thermosonically bonded dc bonds of 0.025 mm (1 mil)

diameter are recommended. Create ball bonds with a force of

40 g to 50 g, and wedge bonds with a force of 18 g to 22 g.

Create all bonds with a nominal stage temperature of 150°C.

Apply the minimum amount of ultrasonic energy (depending

on the process and package being used) to achieve reliable

bonds. Keep all bonds as short as possible, less than 0.31 mm

(12.2 mil).

Alternatively, use short RF bonds that are ≤3 mm and made

with two 1 mm wires.

ADPA7008CHIP 数据表(PDF) 25 Page - Analog Devices

ADPA7008CHIP 数据表(HTML) 25 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

数据表下载