F28384SPTPQR datasheet(97/306 Pages) TI

97 / 306 page

7.9 Thermal Design Considerations

Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems that

exceed the recommended maximum power dissipation in the end product may require additional thermal

enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor

that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care

should be taken to keep TJ within the specified limits. Tcase should be measured to estimate the operating

junction temperature TJ. Tcase is normally measured at the center of the package top-side surface. The thermal

application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and

definitions.

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TMS320F28388D, TMS320F28386D, TMS320F28386D-Q1

TMS320F28384D, TMS320F28384D-Q1, TMS320F28388S

TMS320F28386S, TMS320F28386S-Q1, TMS320F28384S, TMS320F28384S-Q1

SPRSP14D – MAY 2019 – REVISED FEBRUARY 2021

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Product Folder Links: TMS320F28388D TMS320F28386D TMS320F28386D-Q1 TMS320F28384D

TMS320F28384D-Q1 TMS320F28388S TMS320F28386S TMS320F28386S-Q1 TMS320F28384S

TMS320F28384S-Q1

F28384SPTPQR 数据表(PDF) 97 Page - Texas Instruments